Temperature-Aware Computer Systems: Opportunities and Challenges

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http://doi.ieeecomputersociety.org/10.1109/MM.2003.1261387

November/December 2003 (vol. 23 no. 6) pp. 52-61

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	ASCII Text	x
	Kevin Skadron, Mircea R. Stan, Wei Huang, Sivakumar Velusamy, Karthik Sankaranarayanan, David Tarjan, "Temperature-Aware Computer Systems: Opportunities and Challenges," IEEE Micro, vol. 23, no. 6, pp. 52-61, November/December, 2003.

	BibTex	x
	@article{ 10.1109/MM.2003.1261387, author = {Kevin Skadron and Mircea R. Stan and Wei Huang and Sivakumar Velusamy and Karthik Sankaranarayanan and David Tarjan}, title = {Temperature-Aware Computer Systems: Opportunities and Challenges}, journal ={IEEE Micro}, volume = {23}, number = {6}, issn = {0272-1732}, year = {2003}, pages = {52-61}, doi = {http://doi.ieeecomputersociety.org/10.1109/MM.2003.1261387}, publisher = {IEEE Computer Society}, address = {Los Alamitos, CA, USA}, }

	RefWorks Procite/RefMan/Endnote	x
	TY - MGZN JO - IEEE Micro TI - Temperature-Aware Computer Systems: Opportunities and Challenges IS - 6 SN - 0272-1732 SP52 EP61 EPD - 52-61 A1 - Kevin Skadron, A1 - Mircea R. Stan, A1 - Wei Huang, A1 - Sivakumar Velusamy, A1 - Karthik Sankaranarayanan, A1 - David Tarjan, PY - 2003 VL - 23 JA - IEEE Micro ER -

Kevin Skadron, University of Virginia

Mircea R. Stan, University of Virginia

Wei Huang, University of Virginia

Sivakumar Velusamy, University of Virginia

Karthik Sankaranarayanan, University of Virginia

David Tarjan, University of Virginia

Temperature-aware design techniques have an important role to play in addition to traditional techniques like power-aware design and package- and board-level thermal engineering. These authors define the role of architecture techniques and describe HotSpot, an accurate yet fast thermal model suitable for computer architecture research.

Citation:

Kevin Skadron, Mircea R. Stan, Wei Huang, Sivakumar Velusamy, Karthik Sankaranarayanan, David Tarjan, "Temperature-Aware Computer Systems: Opportunities and Challenges," IEEE Micro, vol. 23, no. 6, pp. 52-61, Nov./Dec. 2003, doi:10.1109/MM.2003.1261387

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