D.K.C. Chan, K.R.P.H. Leung, C.Y. Yan, K.C.C. Chan,
"Liaison: A Workflow Model for Novel Applications,"
Asia-Pacific Software Engineering Conference, pp. 144, Fifth Asia-Pacific Software Engineering Conference (APSEC'98), 1998.
BibTex
x
@article{
10.1109/APSEC.1998.733614, author = {D.K.C. Chan and K.R.P.H. Leung and C.Y. Yan and K.C.C. Chan}, title = {Liaison: A Workflow Model for Novel Applications}, journal ={Asia-Pacific Software Engineering Conference}, volume = {0}, year = {1998}, isbn = {0-8186-9183-2}, pages = {144}, doi = {http://doi.ieeecomputersociety.org/10.1109/APSEC.1998.733614}, publisher = {IEEE Computer Society}, address = {Los Alamitos, CA, USA}, }
RefWorks Procite/RefMan/Endnote
x
TY - CONF JO - Asia-Pacific Software Engineering Conference TI - Liaison: A Workflow Model for Novel Applications SN - 0-8186-9183-2 SP EP A1 - D.K.C. Chan, A1 - K.R.P.H. Leung, A1 - C.Y. Yan, A1 - K.C.C. Chan, PY - 1998 VL - 0 JA - Asia-Pacific Software Engineering Conference ER -
PURCHASE ARTICLE: $19
IEEE Xplore Subscribers
Digg
Furl
Spurl
Blink
Simpy
Google
Del.icio.us
Y!MyWeb