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Design-Manufacturing Interface: Part II - Applications
Paris, France February 23-February 26
DOI Bookmark: http://doi.ieeecomputersociety.org/10.1109/DATE.1998.655913Design Automation and Test in Europe ...
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W. Maly, Carnegie Mellon University
P.K. Nag, Carnegie Mellon University
C. Ouyang, Carnegie Mellon University
H.T. Heineken, Level One Communications
J. Khare, Level One Communications
P. Simon, Philips NV, Nijmegen, The Netherlands
This paper illustrates via examples problems at the design-manufacturing interface that exist in the IC industry today, and the ability of the YAN/PODEMA framework in solving these problems. The need for further development of the framework is also emphasized.
Index Terms:
manufacturability, yield, critical area, metal utilization, etch rate variation, antenna effect
Citation:
W. Maly, P.K. Nag, C. Ouyang, H.T. Heineken, J. Khare, P. Simon, "Design-Manufacturing Interface: Part II - Applications," date, pp.557, Design Automation and Test in Europe (DATE '98), 1998
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