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Efficient Techniques for Modeling Chip-Level Interconnect, Substrate and Package Parasitics
Munich, Germany March 09-March 12
DOI Bookmark: http://doi.ieeecomputersociety.org/10.1109/DATE.1999.761158Design, Automation and Test in Europe ...
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Citation:
Peter Feldman, Sharad Kapur, David E. Long, "Efficient Techniques for Modeling Chip-Level Interconnect, Substrate and Package Parasitics," date, pp.418, Design, Automation and Test in Europe (DATE '99), 1999
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