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High Vertical Aspect Ratio Liga Microwave 3-DB Coupler
Banff, Alberta, Canada July 20-July 23
DOI Bookmark: http://doi.ieeecomputersociety.org/10.1109/ICMENS.2003.12219612003 International Conference on MEMS ...
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Anton A. Kachayev, David M. Klymyshyn, Sven Achenbach, Volker Saile, "High Vertical Aspect Ratio Liga Microwave 3-DB Coupler," MEMS, NANO, and Smart Systems, International Conference on, pp. 38, 2003 International Conference on MEMS, NANO and Smart Systems (ICMENS'03), 2003.
 
 
BibTex
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@article{ 10.1109/ICMENS.2003.1221961,
author = {Anton A. Kachayev and David M. Klymyshyn and Sven Achenbach and Volker Saile},
title = {High Vertical Aspect Ratio Liga Microwave 3-DB Coupler},
journal ={MEMS, NANO, and Smart Systems, International Conference on},
volume = {0},
year = {2003},
isbn = {0-7695-1947-4},
pages = {38},
doi = {http://doi.ieeecomputersociety.org/10.1109/ICMENS.2003.1221961},
publisher = {IEEE Computer Society},
address = {Los Alamitos, CA, USA},
}
 
 
RefWorks Procite/RefMan/Endnote
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TY - CONF
JO - MEMS, NANO, and Smart Systems, International Conference on
TI - High Vertical Aspect Ratio Liga Microwave 3-DB Coupler
SN - 0-7695-1947-4
SP
EP
A1 - Anton A. Kachayev,
A1 - David M. Klymyshyn,
A1 - Sven Achenbach,
A1 - Volker Saile,
PY - 2003
KW - LIGA
KW - deep X-ray lithography
KW - high vertical aspect ratio
KW - microwave directional coupler
KW - coupled lines
VL - 0
JA - MEMS, NANO, and Smart Systems, International Conference on
ER -
 
Anton A. Kachayev, TRLabs and University of Saskatchewan
David M. Klymyshyn, TRLabs and University of Saskatchewan
Sven Achenbach, Institute for Microstructure Technology
Volker Saile, Institute for Microstructure Technology
This paper focuses on microwave directional couplers fabricated using synchrotron deep X-ray lithography (DXRL), an advanced micro- and nanofabrication technology allowing the design of microwave structures with improved performance by exploring the third dimension - metal height. Demonstrated are the influence of increased metal height on the structure characteristics and performance unattainable through conventional planar fabrication techniques.
Index Terms:
LIGA, deep X-ray lithography, high vertical aspect ratio, microwave directional coupler, coupled lines
Citation:
Anton A. Kachayev, David M. Klymyshyn, Sven Achenbach, Volker Saile, "High Vertical Aspect Ratio Liga Microwave 3-DB Coupler," icmens, pp.38, 2003 International Conference on MEMS, NANO and Smart Systems (ICMENS'03), 2003
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