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Leveraging Delay Slack in Flip-Flop and Buffer Insertion for Power Reduction
San Jose, California March 22-March 24
DOI Bookmark: http://doi.ieeecomputersociety.org/10.1109/ISQED.2004.12836525th International Symposium on Qualit ...
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Lucanus Simonson, University of California at Los Angeles
King Ho Tam, University of California at Los Angeles
Nataraj Akkiraju, Intel Corporation
Mosur Mohan, Intel Corporation
Lei He, University of California at Los Angeles
We show that the delay slack can be distributed optimally between flip-flops to reduce power in a pipelined interconnect, and such power reduction can be achieved by simultaneous flip-flop and buffer insertion satisfying latency and delay constraints specified at sinks. We develop a dynamic programming algorithm with effective pruning rules and pseudo polynomial time complexity with respect to the decimation and the length of a net. Experiments using a cluster of interconnect in a leading industrial high-performance design show that there exists plenty of useful slack for power reduction. Without jeopardizing the delay specification, as much as 17% of power can be saved for this cluster of interconnects.
Citation:
Lucanus Simonson, King Ho Tam, Nataraj Akkiraju, Mosur Mohan, Lei He, "Leveraging Delay Slack in Flip-Flop and Buffer Insertion for Power Reduction," isqed, pp.69-74, 5th International Symposium on Quality Electronic Design (ISQED'04), 2004
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