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Modeling of Multi-Layered Power Distribution Planes Including Via Effects Using Transmission Matrix Method
Bangalore, India January 07-January 11
DOI Bookmark: http://doi.ieeecomputersociety.org/10.1109/ASPDAC.2002.994886ASP-DAC/VLSI Design 2002
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Joong-Ho Kim, Erdem Matoglu, Jinwoo Choi, Madhavan Swaminathan, "Modeling of Multi-Layered Power Distribution Planes Including Via Effects Using Transmission Matrix Method," VLSI Design, International Conference on, pp. 59, ASP-DAC/VLSI Design 2002, 2002.
 
 
BibTex
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@article{ 10.1109/ASPDAC.2002.994886,
author = {Joong-Ho Kim and Erdem Matoglu and Jinwoo Choi and Madhavan Swaminathan},
title = {Modeling of Multi-Layered Power Distribution Planes Including Via Effects Using Transmission Matrix Method},
journal ={VLSI Design, International Conference on},
volume = {0},
year = {2002},
isbn = {0-7695-1441-3},
pages = {59},
doi = {http://doi.ieeecomputersociety.org/10.1109/ASPDAC.2002.994886},
publisher = {IEEE Computer Society},
address = {Los Alamitos, CA, USA},
}
 
 
RefWorks Procite/RefMan/Endnote
x 
 
TY - CONF
JO - VLSI Design, International Conference on
TI - Modeling of Multi-Layered Power Distribution Planes Including Via Effects Using Transmission Matrix Method
SN - 0-7695-1441-3
SP
EP
A1 - Joong-Ho Kim,
A1 - Erdem Matoglu,
A1 - Jinwoo Choi,
A1 - Madhavan Swaminathan,
PY - 2002
VL - 0
JA - VLSI Design, International Conference on
ER -
 
Joong-Ho Kim, Georgia Institute of Technology
Erdem Matoglu, Georgia Institute of Technology
Jinwoo Choi, Georgia Institute of Technology
Madhavan Swaminathan, Georgia Institute of Technology
This paper presents a method for analyzing multi-layered power distribution networks in the frequency domain.Using a two dimensional array of distributed RLCG circuits,multi-layered power distribution planes are represented.Each plane pair is connected by vias, which are modeled as partial self and mutual inductors. For the efficient computation of the power distribution impedances at specific points in the network,a multi-input and multi-output transmission matrix method has been used, which is much faster than Spice and reduces memory requirements.This method has been compared with the cavity resonator method simulated in Spice.
Citation:
Joong-Ho Kim, Erdem Matoglu, Jinwoo Choi, Madhavan Swaminathan, "Modeling of Multi-Layered Power Distribution Planes Including Via Effects Using Transmission Matrix Method," vlsid, pp.59, ASP-DAC/VLSI Design 2002, 2002
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