We present the experimental evidence, for the first time, that the die surface can act as an RC interconnect, becoming an important factor in determining the voltage of a floating wire created by a CMOS open. We present a circuit model for this effect verified with HSPICE simulations. A detailed analysis of potential mechanisms behind this phenomenon is provided. We also present our measurement results for the trapped charge deposited on floating gates during fabrication.
Index Terms:
CMOS integrated circuits; integrated circuit testing; integrated circuit modelling; VLSI; surface phenomena; electric charge; CMOS opens; die surface; RC interconnect; circuit model; HSPICE simulations; trapped charge; floating gates
Citation:
H. Konuk, F.J. Ferguson, "An unexpected factor in testing for CMOS opens: the die surface," vts, pp.422, 14th IEEE VLSI Test Symposium (VTS '96), 1996