| 14th IEEE VLSI Test Symposium (VTS '96) |
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ISBN:
0-8186-7304-4 |
| Princeton, NJ April 28-May 01 |
pp. xiii
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pp. xiv
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pp. xvi
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pp. xvii
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pp. xix
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pp. xxii
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pp. xxiii
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 | Keynote Address |
 | Invited Talk |
pp. xxviii
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 | Session 1: Design for Testability |
N.A. Touba, Center for Reliable Comput., Stanford Univ., CA, USA
pp. 2
R.D. Blanton, Dept. of Electr. & Comput. Eng., Carnegie Mellon Univ., Pittsburgh, PA, USA
J.P. Hayes, Dept. of Electr. & Comput. Eng., Carnegie Mellon Univ., Pittsburgh, PA, USA
pp. 9
F. Muradali, Dept. of Electr. Eng., McGill Univ., Montreal, Que., Canada
J. Rajski, Dept. of Electr. Eng., McGill Univ., Montreal, Que., Canada
pp. 17
K. Heragu, Center for Reliable & High Performance Comput., Illinois Univ., Urbana, IL, USA
J.H. Patel, Center for Reliable & High Performance Comput., Illinois Univ., Urbana, IL, USA
V.D. Agrawal, Center for Reliable & High Performance Comput., Illinois Univ., Urbana, IL, USA
pp. 32
 | Session 2: Testability of Analog Circuits |
D. Vazquez, Centro Nacional de Microelectron., Seville Univ., Spain
J.L. Huertas, Centro Nacional de Microelectron., Seville Univ., Spain
A. Rueda, Centro Nacional de Microelectron., Seville Univ., Spain
pp. 42
E. Felt, Dept. of Electr. Eng. & Comput. Sci., California Univ., Berkeley, CA, USA
pp. 48
M. Renovell, Lab. d'Inf., Robotique et Microelectronique, Montpellier, France
F. Azais, Lab. d'Inf., Robotique et Microelectronique, Montpellier, France
Y. Bertrand, Lab. d'Inf., Robotique et Microelectronique, Montpellier, France
pp. 54
M. Ehsanian, Dept. of Electr. & Comput. Eng., Ecole Polytech. de Montreal, Que., Canada
B. Kaminska, Dept. of Electr. & Comput. Eng., Ecole Polytech. de Montreal, Que., Canada
K. Arabi, Dept. of Electr. & Comput. Eng., Ecole Polytech. de Montreal, Que., Canada
pp. 60
 | Session 3: Synthesis for Testability |
S. Dey, NEC Res. Inst., Princeton, NJ, USA
pp. 74
R. Rochet, Inst. Nat. Polytech. de Grenoble, France
pp. 81
R.B. Norwood, Center for Reliable Comput., Stanford Univ., CA, USA
pp. 87
Y. Lu, Dept. of Electr. & Comput. Eng., Iowa Univ., Iowa City, IA, USA
I. Pomeranz, Dept. of Electr. & Comput. Eng., Iowa Univ., Iowa City, IA, USA
pp. 93
M. Miegler, Inst. of Comput.-Aided Circuit Design, Erlangen-Nurnberg Univ., Germany
W. Wolz, Inst. of Comput.-Aided Circuit Design, Erlangen-Nurnberg Univ., Germany
pp. 99
 | Session 4: IDDQ Testing |
A. Ferre, Univ. Politecnica de Catalunya, Barcelona, Spain
J. Figueras, Univ. Politecnica de Catalunya, Barcelona, Spain
pp. 106
W. Maly, Carnegie Mellon Univ., Pittsburgh, PA, USA
pp. 112
S.P. Athan, Center for Microelectron. Res., Univ. of South Florida, Tampa, FL, USA
D.L. Landis, Center for Microelectron. Res., Univ. of South Florida, Tampa, FL, USA
S.A. Al-Arian, Center for Microelectron. Res., Univ. of South Florida, Tampa, FL, USA
pp. 118
S. Manich, Univ. Politecnica de Catalunya, Barcelona, Spain
J. Figueras, Univ. Politecnica de Catalunya, Barcelona, Spain
pp. 124
H. Balachandran, Dept. of Electr. Eng., Texas A&M Univ., College Station, TX, USA
D.M.H. Walker, Dept. of Electr. Eng., Texas A&M Univ., College Station, TX, USA
pp. 130
 | Session 5: On-Line Testing |
M. Gossel, Inst. of Control Sci., Acad. of Sci., Moscow, Russia
pp. 138
C. Metra, Dipartimento di Elettronica Inf. e Sistemistica, Bologna Univ., Italy
M. Favalli, Dipartimento di Elettronica Inf. e Sistemistica, Bologna Univ., Italy
B. Ricco, Dipartimento di Elettronica Inf. e Sistemistica, Bologna Univ., Italy
pp. 145
N. Gaitanis, Inst. of Inf., NCSR "Demokritos", Athens, Greece
A. Paschalis, Inst. of Inf., NCSR "Demokritos", Athens, Greece
pp. 151
B. Bose, NEC America Inc., Hillsboro, OR, USA
pp. 157
J.-L. Dufour, RAMS Dept., Matra Transp. Int., Montrouge, France
pp. 169
 | Session 6: Fault Diagnosis and Dictionaries |
V. Boppana, Coordinated Sci. Lab., Illinois Univ., Champaign, IL, USA
I. Hartanto, Coordinated Sci. Lab., Illinois Univ., Champaign, IL, USA
W.K. Fuchs, Coordinated Sci. Lab., Illinois Univ., Champaign, IL, USA
pp. 174
S. Chakravarty, Dept. of Comput. Sci., State Univ. of New York, Buffalo, NY, USA
pp. 192
I. Hartanto, Coordinated Sci. Lab., Illinois Univ., Urbana, IL, USA
W. Kent Fuchs, Coordinated Sci. Lab., Illinois Univ., Urbana, IL, USA
pp. 198
W.K. Huang, Dept. of Comput. Sci., Texas A&M Univ., College Station, TX, USA
X.T. Chen, Dept. of Comput. Sci., Texas A&M Univ., College Station, TX, USA
F. Lombardi, Dept. of Comput. Sci., Texas A&M Univ., College Station, TX, USA
pp. 204
 | Panel Session 1: |
pp. 212
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 | Panel Session 2 |
pp. 214
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 | Session 7: Sequential Circuit Testing |
M.S. Hsiao, Center for Reliable & High Performance Comput., Illinois Univ., Urbana, IL, USA
E.M. Rudnick, Center for Reliable & High Performance Comput., Illinois Univ., Urbana, IL, USA
J.H. Patel, Center for Reliable & High Performance Comput., Illinois Univ., Urbana, IL, USA
pp. 216
D.E. Long, Sun Microsyst., Menlo Park, CA, USA
pp. 224
R.H. Klenke, Dept. of Electr. Eng., Virginia Univ., Charlottesville, VA, USA
J.H. Aylor, Dept. of Electr. Eng., Virginia Univ., Charlottesville, VA, USA
J.M. Wolf, Dept. of Electr. Eng., Virginia Univ., Charlottesville, VA, USA
pp. 231
M. Keim, Inst. of Comput. Sci., Albert-Ludwigs-Univ., Freiburg, Germany
B. Becker, Inst. of Comput. Sci., Albert-Ludwigs-Univ., Freiburg, Germany
B. Stenner, Inst. of Comput. Sci., Albert-Ludwigs-Univ., Freiburg, Germany
pp. 240
J.A. Wehbeh, MIPS Technol. Inc., Mountain View, CA, USA
D.G. Saab, MIPS Technol. Inc., Mountain View, CA, USA
pp. 246
 | Session 8: Multi-Chip Modules and Memory Testing |
T.R. Damarla, Nat. Res. Council, US Army Res. Labs., Fort Monmouth, NJ, USA
M.J. Chung, Nat. Res. Council, US Army Res. Labs., Fort Monmouth, NJ, USA
Wei Su, Nat. Res. Council, US Army Res. Labs., Fort Monmouth, NJ, USA
G.T. Michael, Nat. Res. Council, US Army Res. Labs., Fort Monmouth, NJ, USA
pp. 254
B.C. Kim, Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
A. Chatterjee, Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
M. Swaminathan, Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
pp. 260
G.N. Gaydadjiev, Dept. of Electr. Eng., Delft Univ. of Technol., Netherlands
V.G. Mikitjuk, Dept. of Electr. Eng., Delft Univ. of Technol., Netherlands
V.N. Yarmolik, Dept. of Electr. Eng., Delft Univ. of Technol., Netherlands
pp. 272
M.P. Kluth, Autom. & Intelligent Syst. Unit., Alcatel Alsthom Recherche, Marcoussis, Franc
F. Simon, Autom. & Intelligent Syst. Unit., Alcatel Alsthom Recherche, Marcoussis, Franc
J.Y. Le Gall, Autom. & Intelligent Syst. Unit., Alcatel Alsthom Recherche, Marcoussis, Franc
E. Muller, Autom. & Intelligent Syst. Unit., Alcatel Alsthom Recherche, Marcoussis, Franc
pp. 281
 | Session 9: Delay Fault Testing |
P. Uppaluri, Avant Corp., Research Triangle Park, NC, USA
U. Sparmann, Avant Corp., Research Triangle Park, NC, USA
I. Pomeranz, Avant Corp., Research Triangle Park, NC, USA
pp. 288
S. Cremoux, Lab. d'Inf. de Robotique et de Microelectron., Univ. des Sci. et Tech. du Languedoc, Montpellier, France
C. Fagot, Lab. d'Inf. de Robotique et de Microelectron., Univ. des Sci. et Tech. du Languedoc, Montpellier, France
P. Girard, Lab. d'Inf. de Robotique et de Microelectron., Univ. des Sci. et Tech. du Languedoc, Montpellier, France
C. Landrault, Lab. d'Inf. de Robotique et de Microelectron., Univ. des Sci. et Tech. du Languedoc, Montpellier, France
S. Pravossoudovitch, Lab. d'Inf. de Robotique et de Microelectron., Univ. des Sci. et Tech. du Languedoc, Montpellier, France
pp. 296
V.A. Vardanian, Inst. of Inf. & Autom. Problems, Acad. of Sci., Yerevan, Armenia
pp. 302
S. Crepaux-Motte, Lab. d'Autom., Inst. Nat. Polytech. de Grenoble, St.-Martin-d'Heres, France
M. Jacomino, Lab. d'Autom., Inst. Nat. Polytech. de Grenoble, St.-Martin-d'Heres, France
R. David, Lab. d'Autom., Inst. Nat. Polytech. de Grenoble, St.-Martin-d'Heres, France
pp. 308
 | Session 10: Non-Traditional Testing |
P. Wohl, Microelectron. Div., IBM Corp., Essex Junction, VT, USA
J. Waicukauski, Microelectron. Div., IBM Corp., Essex Junction, VT, USA
M. Graf, Microelectron. Div., IBM Corp., Essex Junction, VT, USA
pp. 324
J.T.-Y. Chang, Center for Reliable Comput., Stanford Univ., CA, USA
pp. 332
M. Renovell, Lab. d'Inf., Robotique et Microelectron., Univ. des Sci. et Tech. du Languedoc, Montpellier, France
P. Huc, Lab. d'Inf., Robotique et Microelectron., Univ. des Sci. et Tech. du Languedoc, Montpellier, France
Y. Bertrand, Lab. d'Inf., Robotique et Microelectron., Univ. des Sci. et Tech. du Languedoc, Montpellier, France
pp. 338
Yuyun Liao, Dept. of Electr. Eng., Texas A&M Univ., College Station, TX, USA
D.M.H. Walker, Dept. of Electr. Eng., Texas A&M Univ., College Station, TX, USA
pp. 344
P. Pant, Georgia Inst. of Technol., Atlanta, GA, USA
pp. 354
 | Panel Session 3: |
pp. 362
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 | Panel Session 4: |
pp. 364
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 | Panel Session 5: |
pp. 366
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 | Session 11: Advances in Built-In Self-Test |
M. Soufi, Ecole Polytech. de Montreal, Que., Canada
S. Rochon, Ecole Polytech. de Montreal, Que., Canada
Y. Savaria, Ecole Polytech. de Montreal, Que., Canada
pp. 368
D. Kagaris, Dept. of Electr. Eng., Southern Illinois Univ., Carbondale, IL, USA
S. Tragoudas, Dept. of Electr. Eng., Southern Illinois Univ., Carbondale, IL, USA
pp. 374
A.P. Stroele, Inst. of Comput. Design & Fault Tolerance, Karlsruhe Univ., Germany
pp. 380
C. Stroud, Dept. of Electr. Eng., Kentucky Univ., Lexington, KY, USA
S. Konala, Dept. of Electr. Eng., Kentucky Univ., Lexington, KY, USA
Ping Chen, Dept. of Electr. Eng., Kentucky Univ., Lexington, KY, USA
M. Abramovici, Dept. of Electr. Eng., Kentucky Univ., Lexington, KY, USA
pp. 387
N.A. Touba, Center for Reliable Comput., Stanford Univ., CA, USA
pp. 393
 | Session 12: Fault Modeling and Defect Coverage |
J. Khare, Dept. of Electr. & Comput. Eng., Carnegie Mellon Univ., Pittsburgh, PA, USA
W. Maly, Dept. of Electr. & Comput. Eng., Carnegie Mellon Univ., Pittsburgh, PA, USA
N. Tiday, Dept. of Electr. & Comput. Eng., Carnegie Mellon Univ., Pittsburgh, PA, USA
pp. 405
P. Dahlgren, Dept. of Comput. Eng., Chalmers Univ. of Technol., Goteborg, Sweden
P. Liden, Dept. of Comput. Eng., Chalmers Univ. of Technol., Goteborg, Sweden
pp. 414
H. Konuk, California Design Center, Hewlett-Packard Co., CA, USA
F.J. Ferguson, California Design Center, Hewlett-Packard Co., CA, USA
pp. 422
S.M. Reddy, Dept. of Electr. & Comput. Eng., Iowa Univ., Iowa City, IA, USA
I. Pomeranz, Dept. of Electr. & Comput. Eng., Iowa Univ., Iowa City, IA, USA
S. Kajihara, Dept. of Electr. & Comput. Eng., Iowa Univ., Iowa City, IA, USA
pp. 430
 | Session 13: Fault Simulation and Test Generation |
M.B. Amin, Dept. of Comput. Sci., Minnesota Univ., Minneapolis, MN, USA
B. Vinnakota, Dept. of Comput. Sci., Minnesota Univ., Minneapolis, MN, USA
pp. 438
A. Vergis, Dept. of Comput. Eng., Patras Univ., Greece
C. Tobon, Dept. of Comput. Eng., Patras Univ., Greece
pp. 444
W.K. Huang, Dept. of Comput. Sci., Texas A&M Univ., College Station, TX, USA
F. Lombardi, Dept. of Comput. Sci., Texas A&M Univ., College Station, TX, USA
pp. 450
T. Lee, Gen. Syst. Lab., Hewlett-Packard Co., Roseville, CA, USA
I.N. Hajj, Gen. Syst. Lab., Hewlett-Packard Co., Roseville, CA, USA
E.M. Rudnick, Gen. Syst. Lab., Hewlett-Packard Co., Roseville, CA, USA
J.H. Patel, Gen. Syst. Lab., Hewlett-Packard Co., Roseville, CA, USA
pp. 456
D.K. Das, Dept. of Comput. Sci. & Eng., Jadavpur Univ., Calcutta, India
pp. 463
 | Session 14: Mixed-Signal Test Techniques |
H.H. Zheng, Comput. Eng. Res. Center, Texas Univ., Austin, TX, USA
A. Balivada, Comput. Eng. Res. Center, Texas Univ., Austin, TX, USA
J.A. Abraham, Comput. Eng. Res. Center, Texas Univ., Austin, TX, USA
pp. 470
K. Arabi, Dept. of Electr. & Comput. Eng., Ecole Polytech. de Montreal, Que., Canada
B. Kaminska, Dept. of Electr. & Comput. Eng., Ecole Polytech. de Montreal, Que., Canada
pp. 476
B. Vinnakota, Dept. of Electr. Eng., Minnesota Univ., Minneapolis, MN, USA
pp. 483
Chen-Yang Pan, Dept. of Electr. & Comput. Eng., California Univ., Santa Barbara, CA, USA
Kwang-Ting Cheng, Dept. of Electr. & Comput. Eng., California Univ., Santa Barbara, CA, USA
pp. 489
 | Panel Session 6: |
pp. 502
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 | Panel Session 7: |
pp. 504
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 | Panel Session 8: |
pp. 506
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pp. 508
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