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Thermal Testing: Fault Location Strategies
Montreal, Canada April 30-May 04
DOI Bookmark: http://doi.ieeecomputersociety.org/10.1109/VTEST.2000.84384418th IEEE VLSI Test Symposium (VTS'00)
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J. Altet, Polytechnical University of Catalonia (UPC)
A. Rubio, Polytechnical University of Catalonia (UPC)
E. Schaub, Universite Bordeaux 1
S. Dialhaire, Universite Bordeaux 1
W. Claeys, Universite Bordeaux 1
By measuring the temperature at some points of an IC during a test procedure, defects can be detected (fault testing). With a simple processing of the measured temperature waveform, the distance between the temperature monitoring point and the activated defect can be derived. This paper presents four temperature-measuring strategies to determine this distance for diagnosis purposes.
Index Terms:
Thermal Testing, Temperature Measurements, Built-In Differential Temperature Sensors, Fault Location, Mixed-Signal Circuits
Citation:
J. Altet, A. Rubio, E. Schaub, S. Dialhaire, W. Claeys, "Thermal Testing: Fault Location Strategies," vts, pp.189, 18th IEEE VLSI Test Symposium (VTS'00), 2000
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