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IC Failure Analysis: Magic, Mystery, and Science
DOI Bookmark: http://doi.ieeecomputersociety.org/10.1109/54.605998July-September 1997 (vol. 14 no. 3) pp. 59-69
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Jerry M. Soden, Richard E. Anderson, Chris L. Henderson, "IC Failure Analysis: Magic, Mystery, and Science," IEEE Design and Test of Computers, vol. 14, no. 3, pp. 59-69, July-September, 1997.
 
 
BibTex
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@article{ 10.1109/54.605998,
author = {Jerry M. Soden and Richard E. Anderson and Chris L. Henderson},
title = {IC Failure Analysis: Magic, Mystery, and Science},
journal ={IEEE Design and Test of Computers},
volume = {14},
number = {3},
issn = {0740-7475},
year = {1997},
pages = {59-69},
doi = {http://doi.ieeecomputersociety.org/10.1109/54.605998},
publisher = {IEEE Computer Society},
address = {Los Alamitos, CA, USA},
}
 
 
RefWorks Procite/RefMan/Endnote
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TY - MGZN
JO - IEEE Design and Test of Computers
TI - IC Failure Analysis: Magic, Mystery, and Science
IS - 3
SN - 0740-7475
SP59
EP69
EPD - 59-69
A1 - Jerry M. Soden,
A1 - Richard E. Anderson,
A1 - Chris L. Henderson,
PY - 1997
VL - 14
JA - IEEE Design and Test of Computers
ER -
 

Advancing IC and packaging technologies motivate and direct the future of failure analysis. The authors review current tools and techniques and discuss challenges and opportunities created by the industry's critical need for new diagnosis and failure analysis paradigms.

Citation:
Jerry M. Soden, Richard E. Anderson, Chris L. Henderson, "IC Failure Analysis: Magic, Mystery, and Science," IEEE Design and Test of Computers, vol. 14, no. 3, pp. 59-69, July-Sept. 1997, doi:10.1109/54.605998
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