A 1Tb/s 3W inter-chip transceiver transmits clock and data by inductive coupling at a clock rate of 1GHz and data rate of 1Gb/s per channel. 1024 data transceivers are arranged with a pitch of 30 mum in a layout area of 1mm². The total layout area including 16 clock transceivers is 2mm² in 0.18 mum CMOS and the chip thickness is reduced to 10 mum. Simple yet accurate model of inductive coupling is utilized for transceiver design. Bi-phase modulation (BPM) is employed for the data link to improve noise immunity, reducing power in the transceiver. 4-phase time division multiplexing (TDM) reduces crosstalk and channel pitch. The BER is lower than 10^-13 with 150ps timing margin.