Thermal-driven Symmetry Constraint for Analog Layout with CBL Representation

Yokohama January 23-January 26

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http://doi.ieeecomputersociety.org/10.1109/ASPDAC.2007.357984

2007 Asia and South Pacific Design Au ...

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	ASCII Text	x
	null Jiayi Liu, null Sheqin Dong, null Yuchun Ma, null Di Long, null Xianlong Hong, "Thermal-driven Symmetry Constraint for Analog Layout with CBL Representation," Asia and South Pacific Design Automation Conference, pp. 191-196, 2007 Asia and South Pacific Design Automation Conference, 2007.

	BibTex	x
	@article{ 10.1109/ASPDAC.2007.357984, author = {null Jiayi Liu and null Sheqin Dong and null Yuchun Ma and null Di Long and null Xianlong Hong}, title = {Thermal-driven Symmetry Constraint for Analog Layout with CBL Representation}, journal ={Asia and South Pacific Design Automation Conference}, volume = {0}, year = {2007}, isbn = {1-4244-0629-3}, pages = {191-196}, doi = {http://doi.ieeecomputersociety.org/10.1109/ASPDAC.2007.357984}, publisher = {IEEE Computer Society}, address = {Los Alamitos, CA, USA}, }

	RefWorks Procite/RefMan/Endnote	x
	TY - CONF JO - Asia and South Pacific Design Automation Conference TI - Thermal-driven Symmetry Constraint for Analog Layout with CBL Representation SN - 1-4244-0629-3 SP191 EP196 A1 - null Jiayi Liu, A1 - null Sheqin Dong, A1 - null Yuchun Ma, A1 - null Di Long, A1 - null Xianlong Hong, PY - 2007 KW - thermal-optimal placement KW - thermal-driven symmetry constraint KW - analog layout KW - thermal constraint KW - hot-spot effect KW - temperature gradient KW - symmetrical devices KW - thermal model KW - placement process KW - geometric symmetry KW - corner block list VL - 0 JA - Asia and South Pacific Design Automation Conference ER -

null Jiayi Liu, DCST, Tsinghua Univ., Beijing

null Sheqin Dong, DCST, Tsinghua Univ., Beijing

null Yuchun Ma, DCST, Tsinghua Univ., Beijing

null Di Long, DCST, Tsinghua Univ., Beijing

null Xianlong Hong, DCST, Tsinghua Univ., Beijing

In the context of SOI, thermal constraint is more serious for analog devices. Besides the hot-spot effect, the temperature gradient on symmetrical devices may cause errors and even failures in the function. In order to handle these problems, this paper introduces an accurate thermal model into the placement process. Based on the geometric symmetry which is achieved with corner block list (CBL) for the first time, the thermal model helps to find the thermal-optimal placement. And the experimental results show this method is promising.

Index Terms:

thermal-optimal placement, thermal-driven symmetry constraint, analog layout, thermal constraint, hot-spot effect, temperature gradient, symmetrical devices, thermal model, placement process, geometric symmetry, corner block list

Citation:

null Jiayi Liu, null Sheqin Dong, null Yuchun Ma, null Di Long, null Xianlong Hong, "Thermal-driven Symmetry Constraint for Analog Layout with CBL Representation," asp-dac, pp.191-196, 2007 Asia and South Pacific Design Automation Conference, 2007

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