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Error Tolerance of DNA Self-Healing Assemblies by Puncturing
Rome, Italy September 26-September 28
DOI Bookmark: http://doi.ieeecomputersociety.org/10.1109/DFT.2007.822nd IEEE International Symposium on ...
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Masoud Hashempour, Zahra Mashreghian Arani, Fabrizio Lombardi, "Error Tolerance of DNA Self-Healing Assemblies by Puncturing," Defect and Fault-Tolerance in VLSI Systems, IEEE International Symposium on, pp. 400-408, 22nd IEEE International Symposium on Defect and Fault-Tolerance in VLSI Systems (DFT 2007), 2007.
 
 
BibTex
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@article{ 10.1109/DFT.2007.8,
author = {Masoud Hashempour and Zahra Mashreghian Arani and Fabrizio Lombardi},
title = {Error Tolerance of DNA Self-Healing Assemblies by Puncturing},
journal ={Defect and Fault-Tolerance in VLSI Systems, IEEE International Symposium on},
volume = {0},
year = {2007},
isbn = {0-7695-2885-6},
pages = {400-408},
doi = {http://doi.ieeecomputersociety.org/10.1109/DFT.2007.8},
publisher = {IEEE Computer Society},
address = {Los Alamitos, CA, USA},
}
 
 
RefWorks Procite/RefMan/Endnote
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TY - CONF
JO - Defect and Fault-Tolerance in VLSI Systems, IEEE International Symposium on
TI - Error Tolerance of DNA Self-Healing Assemblies by Puncturing
SN - 0-7695-2885-6
SP400
EP408
A1 - Masoud Hashempour,
A1 - Zahra Mashreghian Arani,
A1 - Fabrizio Lombardi,
PY - 2007
KW - null
VL - 0
JA - Defect and Fault-Tolerance in VLSI Systems, IEEE International Symposium on
ER -
 
Masoud Hashempour, Northeastern University, Dept. of ECE, Boston MA
Zahra Mashreghian Arani, Northeastern University, Dept. of ECE, Boston MA
Fabrizio Lombardi, Northeastern University, Dept. of ECE, Boston MA
Self-assembly is affected by high error rates due to incorrect tiles in nano-technology manufacturing. Tile sets that can heal (fully or partially) an erroneous assembly have been proposed. Self-healing requires growth to be restarted such that erroneous tiles can be removed and the correct tiles to bind to the aggregate. Punctures can be used for this purpose. The goal of this paper is to characterize an intentionally induced puncture (and its relevant properties) on an erroneous tile site in the assembly. This allows to propagate any newly generated error away from the source of growth (i.e. the seed tile), such that self-assembly can continue along specific directions. Different types of puncture are considered with respect to growth direction, error and aggregate types. Puncture resilience is analyzed using a new characterization metric; different tile sets are investigated in detail. Analytical and simulation results are provided.
Citation:
Masoud Hashempour, Zahra Mashreghian Arani, Fabrizio Lombardi, "Error Tolerance of DNA Self-Healing Assemblies by Puncturing," dft, pp.400-408, 22nd IEEE International Symposium on Defect and Fault-Tolerance in VLSI Systems (DFT 2007), 2007
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