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Wrapper Design for the Reuse of Networks-on-Chip as Test Access Mechanism
Southampton, United Kingdom May 21-May 21
DOI Bookmark: http://doi.ieeecomputersociety.org/10.1109/ETS.2006.48Eleventh IEEE European Test Symposium ...
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Alexandre M. Amory, Federal University of RGS - UFRG, Brazil
Kees Goossens, Philips Research Laboratories, The Netherlands
Erik Jan Marinissen, Philips Research Laboratories, The Netherlands
Marcelo Lubaszewski, Federal University of RGS - UFRGS, Brazil
Fernando Moraes, Catholic University - PUCRS, Brazil
This paper proposes a wrapper design for interconnects with guaranteed bandwidth and latency services and on-chip protocol. We demonstrate that these interconnects abstract the interconnect details and provide predictability in the data transfer, which are desirable not only for the functional domain but also for the test application. The proposed wrapper is implemented in VHDL and integrated to the ?thereal NoC. The results show the impact of of bandwidth in the core test time. The wrapper area and core test time are compared with a wrapper design for dedicated TAM.
Citation:
Alexandre M. Amory, Kees Goossens, Erik Jan Marinissen, Marcelo Lubaszewski, Fernando Moraes, "Wrapper Design for the Reuse of Networks-on-Chip as Test Access Mechanism," ets, pp.213-218, Eleventh IEEE European Test Symposium (ETS'06), 2006
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