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Trends and Trade-offs in Designing Highly Robust Throughput on Chip Communication Network
Lake of Como, Italy July 10-July 12
DOI Bookmark: http://doi.ieeecomputersociety.org/10.1109/IOLTS.2006.6412th IEEE International On-Line Testi ...
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Marcello Coppola, STMicroelectronics, France
Moore's law predicts that soon it will be possible to integrate billions of transistors on a single chip. Currently on-chip communication for multiprocessor system-on-chip (MPSoC) is realized using buses such as AMBA, STbus, and IBM?s Core-connect. On-chip buses are not fundamentally different than computer buses, except that they are designed and optimized to operate entirely within a single chip meaning that wider buses are possible, and there is no constraint to the number of pins. These buses typically include a number of address and data wires, bi-directional signaling for management, and a complex arbitration policy. Since wire delay becomes more critical than computation delay, bus implementations for future SoC will be increasingly hard. For example, placement and routing for on-chip buses is extremely complex due to the large number of wires. Thus, a SoC bus may occupy an area comparable to a processing element.
Citation:
Marcello Coppola, "Trends and Trade-offs in Designing Highly Robust Throughput on Chip Communication Network," iolts, pp.80, 12th IEEE International On-Line Testing Symposium (IOLTS'06), 2006
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