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Simulating and Improving Microelectronic Device Reliability by Scaling Voltage and Temperature
San Jose, California March 21-March 23
DOI Bookmark: http://doi.ieeecomputersociety.org/10.1109/ISQED.2005.110Sixth International Symposium on Qual ...
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Xiaojun Li, University of Maryland, College Park, MD
Joerg D. Walter, University of Maryland, College Park, MD
Joseph B. Bernstein, University of Maryland, College Park, MD
The purpose of this work is to explore how device operation parameters such as switching speed and power dissipation scale with voltage and temperature. We simulated a CMOS ring oscillator under different stress conditions to determine the accurate scaling relations of these operating parameters. Reduced voltage, frequency and temperature applied to a device will reduce its internal stresses, leading to an improvement of device reliability. Since all these variations for a single device are proportional, the ratios can be applied to a full circuit and help to simplify the derating model and formulate practical design guidelines for system developers to derate devices for long life applications.
Citation:
Xiaojun Li, Joerg D. Walter, Joseph B. Bernstein, "Simulating and Improving Microelectronic Device Reliability by Scaling Voltage and Temperature," isqed, pp.496-502, Sixth International Symposium on Quality of Electronic Design (ISQED'05), 2005
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