"Modeling and Design of Chip-Package Interface,"
Quality Electronic Design, International Symposium on, pp. 6-6, Sixth International Symposium on Quality of Electronic Design (ISQED'05), 2005.
BibTex
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@article{
10.1109/ISQED.2005.78, author = {}, title = {Modeling and Design of Chip-Package Interface}, journal ={Quality Electronic Design, International Symposium on}, volume = {0}, year = {2005}, isbn = {0-7695-2301-3}, pages = {6-6}, doi = {http://doi.ieeecomputersociety.org/10.1109/ISQED.2005.78}, publisher = {IEEE Computer Society}, address = {Los Alamitos, CA, USA}, }
RefWorks Procite/RefMan/Endnote
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TY - CONF JO - Quality Electronic Design, International Symposium on TI - Modeling and Design of Chip-Package Interface SN - 0-7695-2301-3 SP6 EP6 PY - 2005 KW - null VL - 0 JA - Quality Electronic Design, International Symposium on ER -
Citation:
"Modeling and Design of Chip-Package Interface," isqed, pp.6-6, Sixth International Symposium on Quality of Electronic Design (ISQED'05), 2005
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