In analog layout, the placement and routing are closely connected with each other in the optimization of the area, the parasitics, the routability and so on. In this paper, we introduce a common data-structure to the placement and multilayer routing, where devices and wires are represented by united rectangles. It is called Multi-Layer Sequence-Pair (Multi-SP). We also provide a bi-directional translation between a layout and a Multi-SP under align-constraint.Since the Multi-SP is geometry free, it enables us to manage diversified methodologies such as device sizing and technology migration. Also, it gives a way to take the parasitics between devices and wires of optimizing placement and routing simultaneously. We implemented a compaction tool based on Multi-SP and showed its potential experimentally.