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Button Component Encasing for Wearable Technology Applications
Osaka, Japan October 18-October 21
DOI Bookmark: http://doi.ieeecomputersociety.org/10.1109/ISWC.2005.14Ninth IEEE International Symposium on ...
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Jaana Htinnikainen, Tampere University of Technology/Institute of Electronics Korkeakoulunkatu 3, P.O. Box 692,FIN-33 720 Tampere, FINLAND
Jussi Mikkonen, Tampere University of Technology/Institute of Electronics Korkeakoulunkatu 3, P.O. Box 692,FIN-33 720 Tampere, FINLAND
Jukka Vanhala, Tampere University of Technology/Institute of Electronics Korkeakoulunkatu 3, P.O. Box 692,FIN-33 720 Tampere, FINLAND

This paper describes a novel bulfon component encasing for wearable technology applications. The button covers the electronics inside and forms a galvanic contact for communications between the hard electronics and textiles. However, the apprearance and usability of the clothing are maintained. A protolype for the encasing has been implemented, in which a temperature sensor is embedded inside the button The contact between the button and clothing IS implemented by sewing with electrrcally conductive fiber yarn Protowpe tests have shown that the encasing IS directly suitable to be used in a range of applications and galvanic connections are possible to implement by sewing with electrically conductive fibers.

Citation:
Jaana Htinnikainen, Jussi Mikkonen, Jukka Vanhala, "Button Component Encasing for Wearable Technology Applications," iswc, pp.204-205, Ninth IEEE International Symposium on Wearable Computers (ISWC'05), 2005
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