Embroidering Electrical Interconnects with Conductive Yarn for The Integration of Flexible Electronic Modules into Fabric

Osaka, Japan October 18-October 21

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http://doi.ieeecomputersociety.org/10.1109/ISWC.2005.19

Ninth IEEE International Symposium on ...

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	Torsten Linz, Christine Kallmayer, Rolf Aschenbrenner, Herbert Reichl, "Embroidering Electrical Interconnects with Conductive Yarn for The Integration of Flexible Electronic Modules into Fabric," Wearable Computers, IEEE International Symposium, pp. 86-91, Ninth IEEE International Symposium on Wearable Computers (ISWC'05), 2005.

	BibTex	x
	@article{ 10.1109/ISWC.2005.19, author = {Torsten Linz and Christine Kallmayer and Rolf Aschenbrenner and Herbert Reichl}, title = {Embroidering Electrical Interconnects with Conductive Yarn for The Integration of Flexible Electronic Modules into Fabric}, journal ={Wearable Computers, IEEE International Symposium}, volume = {0}, year = {2005}, isbn = {0-7695-2419-2}, pages = {86-91}, doi = {http://doi.ieeecomputersociety.org/10.1109/ISWC.2005.19}, publisher = {IEEE Computer Society}, address = {Los Alamitos, CA, USA}, }

	RefWorks Procite/RefMan/Endnote	x
	TY - CONF JO - Wearable Computers, IEEE International Symposium TI - Embroidering Electrical Interconnects with Conductive Yarn for The Integration of Flexible Electronic Modules into Fabric SN - 0-7695-2419-2 SP86 EP91 A1 - Torsten Linz, A1 - Christine Kallmayer, A1 - Rolf Aschenbrenner, A1 - Herbert Reichl, PY - 2005 KW - null VL - 0 JA - Wearable Computers, IEEE International Symposium ER -

Torsten Linz, Fraunhofer IZM Gustav-Meyer-Allee 25 13355 Berlin, Germany

Christine Kallmayer, Fraunhofer IZM Gustav-Meyer-Allee 25 13355 Berlin, Germany

Rolf Aschenbrenner, Fraunhofer IZM Gustav-Meyer-Allee 25 13355 Berlin, Germany

Herbert Reichl, Fraunhofer IZM Gustav-Meyer-Allee 25 13355 Berlin, Germany

This paper shows how common embroidery can be used to integrate electronics into textile environment in a light and cost efficient way. A mechanism has been developed to embroider through flexible electronic modules using conductive yarn, thus creating an interconnection with other modules like sensors, batteries, textile keyboards, etc. Mold encapsulation has been found to improve the electrical contact and support the reliability of the whole system.

Citation:

Torsten Linz, Christine Kallmayer, Rolf Aschenbrenner, Herbert Reichl, "Embroidering Electrical Interconnects with Conductive Yarn for The Integration of Flexible Electronic Modules into Fabric," iswc, pp.86-91, Ninth IEEE International Symposium on Wearable Computers (ISWC'05), 2005

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