Intrinsic Area Array ICs: What, Why, and How?

Santa Cruz, CA February 04-February 05

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http://doi.ieeecomputersociety.org/10.1109/MCMC.1997.569355

1997 IEEE Multi-Chip Module Conferenc ...

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	ASCII Text	x
	Peyman Dehkordi, Chandra Tan, Donald Bouldin, "Intrinsic Area Array ICs: What, Why, and How?," Multi-Chip Module Conference, IEEE, pp. 120, 1997 IEEE Multi-Chip Module Conference (MCMC '97), 1997.

	BibTex	x
	@article{ 10.1109/MCMC.1997.569355, author = {Peyman Dehkordi and Chandra Tan and Donald Bouldin}, title = {Intrinsic Area Array ICs: What, Why, and How?}, journal ={Multi-Chip Module Conference, IEEE}, volume = {0}, year = {1997}, isbn = {0-8186-7789-9}, pages = {120}, doi = {http://doi.ieeecomputersociety.org/10.1109/MCMC.1997.569355}, publisher = {IEEE Computer Society}, address = {Los Alamitos, CA, USA}, }

	RefWorks Procite/RefMan/Endnote	x
	TY - CONF JO - Multi-Chip Module Conference, IEEE TI - Intrinsic Area Array ICs: What, Why, and How? SN - 0-8186-7789-9 SP EP A1 - Peyman Dehkordi, A1 - Chandra Tan, A1 - Donald Bouldin, PY - 1997 KW - integrated circuit design KW - intrinsic area array ICs KW - area-array bonding technology KW - IC design KW - flip-chip technology KW - C4 bonding VL - 0 JA - Multi-Chip Module Conference, IEEE ER -

Peyman Dehkordi, The University of Tennessee, Tennessee, USA

Chandra Tan, The University of Tennessee, Tennessee, USA

Donald Bouldin, The University of Tennessee, Tennessee, USA

Area-array bonding technology (i.e. flip-chip, C4) was pioneered by IBM in the late 1960's as an alternative to periphery bonding technology (i.e. wire-bond). In recent years, several commercial companies have started offering bumping and flip-chip services. Flip-chip technology is expected to grow at at compound annual growth rate of 38% through the year 2001. The purpose of this paper is to address the IC design issues and alternatives that are presently being used for area-array bonding technology and show the impact of these design issues at the system level.

Index Terms:

integrated circuit design, intrinsic area array ICs, area-array bonding technology, IC design, flip-chip technology, C4 bonding

Citation:

Peyman Dehkordi, Chandra Tan, Donald Bouldin, "Intrinsic Area Array ICs: What, Why, and How?," mcmc, pp.120, 1997 IEEE Multi-Chip Module Conference (MCMC '97), 1997

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