On-Chip Self-Calibrating Communication Techniques Robust to Electrical Parameter Variations

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http://doi.ieeecomputersociety.org/10.1109/MDT.2004.96

November/December 2004 (vol. 21 no. 6) pp. 524-535

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	Fr?d?ric Worm, Paolo Ienne, Patrick Thiran, Giovanni De Micheli, "On-Chip Self-Calibrating Communication Techniques Robust to Electrical Parameter Variations," IEEE Design and Test of Computers, vol. 21, no. 6, pp. 524-535, November/December, 2004.

	BibTex	x
	@article{ 10.1109/MDT.2004.96, author = {Fr?d?ric Worm and Paolo Ienne and Patrick Thiran and Giovanni De Micheli}, title = {On-Chip Self-Calibrating Communication Techniques Robust to Electrical Parameter Variations}, journal ={IEEE Design and Test of Computers}, volume = {21}, number = {6}, issn = {0740-7475}, year = {2004}, pages = {524-535}, doi = {http://doi.ieeecomputersociety.org/10.1109/MDT.2004.96}, publisher = {IEEE Computer Society}, address = {Los Alamitos, CA, USA}, }

	RefWorks Procite/RefMan/Endnote	x
	TY - MGZN JO - IEEE Design and Test of Computers TI - On-Chip Self-Calibrating Communication Techniques Robust to Electrical Parameter Variations IS - 6 SN - 0740-7475 SP524 EP535 EPD - 524-535 A1 - Fr?d?ric Worm, A1 - Paolo Ienne, A1 - Patrick Thiran, A1 - Giovanni De Micheli, PY - 2004 VL - 21 JA - IEEE Design and Test of Computers ER -

Fr?d?ric Worm, Swiss Federal Institute of Technology Lausanne

Paolo Ienne, Swiss Federal Institute of Technology Lausanne

Patrick Thiran, Swiss Federal Institute of Technology Lausanne

Giovanni De Micheli, Stanford University

Editor's note: Dynamic self-calibration holds the promise of overcoming conservative worst-case design techniques needed to combat deep-submicron process and operating variations. This article proposes an on-chip point-to-point interconnect scheme characterized by self-calibration that can operate dynamically to achieve the best energy/performance trade-off. —Soha Hassoun, Tufts University

Citation:

Fr?d?ric Worm, Paolo Ienne, Patrick Thiran, Giovanni De Micheli, "On-Chip Self-Calibrating Communication Techniques Robust to Electrical Parameter Variations," IEEE Design and Test of Computers, vol. 21, no. 6, pp. 524-535, Nov./Dec. 2004, doi:10.1109/MDT.2004.96

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