Bridging the Processor-Memory Performance Gapwith 3D IC Technology

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http://doi.ieeecomputersociety.org/10.1109/MDT.2005.134

November/December 2005 (vol. 22 no. 6) pp. 556-564

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	Christianto C. Liu, Ilya Ganusov, Martin Burtscher, Sandip Tiwari, "Bridging the Processor-Memory Performance Gapwith 3D IC Technology," IEEE Design and Test of Computers, vol. 22, no. 6, pp. 556-564, November/December, 2005.

	BibTex	x
	@article{ 10.1109/MDT.2005.134, author = {Christianto C. Liu and Ilya Ganusov and Martin Burtscher and Sandip Tiwari}, title = {Bridging the Processor-Memory Performance Gapwith 3D IC Technology}, journal ={IEEE Design and Test of Computers}, volume = {22}, number = {6}, issn = {0740-7475}, year = {2005}, pages = {556-564}, doi = {http://doi.ieeecomputersociety.org/10.1109/MDT.2005.134}, publisher = {IEEE Computer Society}, address = {Los Alamitos, CA, USA}, }

	RefWorks Procite/RefMan/Endnote	x
	TY - MGZN JO - IEEE Design and Test of Computers TI - Bridging the Processor-Memory Performance Gapwith 3D IC Technology IS - 6 SN - 0740-7475 SP556 EP564 EPD - 556-564 A1 - Christianto C. Liu, A1 - Ilya Ganusov, A1 - Martin Burtscher, A1 - Sandip Tiwari, PY - 2005 KW - three-dimensional integration 3-D ICs microprocessor cache design stream prefetching embedded DRAM VL - 22 JA - IEEE Design and Test of Computers ER -

Christianto C. Liu, Cornell University

Ilya Ganusov, Cornell University

Martin Burtscher, Cornell University

Sandip Tiwari, Cornell University

Bringing the memory close to the processor is obviously a good idea forreducing latency, but the memory is not a monolith: It includes submodules, and their arrangement determines the effectiveness of using 3D technology. The authors look at various scenarios for arranging the CPU relative to the memory modules and provide a quantitative comparison.

Index Terms:

three-dimensional integration 3-D ICs microprocessor cache design stream prefetching embedded DRAM

Citation:

Christianto C. Liu, Ilya Ganusov, Martin Burtscher, Sandip Tiwari, "Bridging the Processor-Memory Performance Gapwith 3D IC Technology," IEEE Design and Test of Computers, vol. 22, no. 6, pp. 556-564, Nov./Dec. 2005, doi:10.1109/MDT.2005.134

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