W. Rhett Davis, John Wilson, Stephen Mick, Jian Xu, Hao Hua, Christopher Mineo, Ambarish M. Sule, Michael Steer, Paul D. Franzon, "Demystifying 3D ICs: The Pros and Cons of Going Vertical," IEEE Design and Test of Computers, vol. 22, no. 6, pp. 498-510, November/December, 2005.

@article{ 10.1109/MDT.2005.136,
author = {W. Rhett Davis and John Wilson and Stephen Mick and Jian Xu and Hao Hua and Christopher Mineo and Ambarish M. Sule and Michael Steer and Paul D. Franzon},
title = {Demystifying 3D ICs: The Pros and Cons of Going Vertical},
journal ={IEEE Design and Test of Computers},
volume = {22},
number = {6},
issn = {0740-7475},
year = {2005},
pages = {498-510},
doi = {http://doi.ieeecomputersociety.org/10.1109/MDT.2005.136},
publisher = {IEEE Computer Society},
address = {Los Alamitos, CA, USA},
}

TY - MGZN
JO - IEEE Design and Test of Computers
TI - Demystifying 3D ICs: The Pros and Cons of Going Vertical
IS - 6
SN - 0740-7475
SP498
EP510
EPD - 498-510
A1 - W. Rhett Davis,
A1 - John Wilson,
A1 - Stephen Mick,
A1 - Jian Xu,
A1 - Hao Hua,
A1 - Christopher Mineo,
A1 - Ambarish M. Sule,
A1 - Michael Steer,
A1 - Paul D. Franzon,
PY - 2005
KW - Parallel I/O
KW - I/O and Data Communications
KW - Transmitters
KW - Receivers
KW - C.0.e System architectures
KW - integration and modeling
KW - Interconnection architectures
KW - Placement and routing
KW - Routing and layout
VL - 22
JA - IEEE Design and Test of Computers
ER -