Cell Phone Integration: SiP, SoC, and PoP

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http://doi.ieeecomputersociety.org/10.1109/MDT.2006.64

May/June 2006 (vol. 23 no. 3) pp. 188-195

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	Peter Rickert, William Krenik, "Cell Phone Integration: SiP, SoC, and PoP," IEEE Design and Test of Computers, vol. 23, no. 3, pp. 188-195, May/June, 2006.

	BibTex	x
	@article{ 10.1109/MDT.2006.64, author = {Peter Rickert and William Krenik}, title = {Cell Phone Integration: SiP, SoC, and PoP}, journal ={IEEE Design and Test of Computers}, volume = {23}, number = {3}, issn = {0740-7475}, year = {2006}, pages = {188-195}, doi = {http://doi.ieeecomputersociety.org/10.1109/MDT.2006.64}, publisher = {IEEE Computer Society}, address = {Los Alamitos, CA, USA}, }

	RefWorks Procite/RefMan/Endnote	x
	TY - MGZN JO - IEEE Design and Test of Computers TI - Cell Phone Integration: SiP, SoC, and PoP IS - 3 SN - 0740-7475 SP188 EP195 EPD - 188-195 A1 - Peter Rickert, A1 - William Krenik, PY - 2006 KW - SiP KW - SoC KW - PiP KW - PoP KW - analog integration KW - RF integration KW - memory integration VL - 23 JA - IEEE Design and Test of Computers ER -

Peter Rickert, Texas Instruments

William Krenik, Texas Instruments

Editor's note: Engineers must make many cost-effective decisions during a product'sdesign cycle. One challenge is deciding on the best packaging for their products. This article presents trade-offs among system-in-package, system-on-chip, package-on-package and integration for mobile phone applications.

Index Terms:

SiP, SoC, PiP, PoP, analog integration, RF integration, memory integration

Citation:

Peter Rickert, William Krenik, "Cell Phone Integration: SiP, SoC, and PoP," IEEE Design and Test of Computers, vol. 23, no. 3, pp. 188-195, May/June 2006, doi:10.1109/MDT.2006.64

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