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The Need for a SiP Design and Test Infrastructure
DOI Bookmark: http://doi.ieeecomputersociety.org/10.1109/MDT.2006.83May/June 2006 (vol. 23 no. 3) pp. 181
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Kwang-Ting (Tim) Cheng, "The Need for a SiP Design and Test Infrastructure," IEEE Design and Test of Computers, vol. 23, no. 3, pp. 181, May/June, 2006.
 
 
BibTex
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@article{ 10.1109/MDT.2006.83,
author = {Kwang-Ting (Tim) Cheng},
title = {The Need for a SiP Design and Test Infrastructure},
journal ={IEEE Design and Test of Computers},
volume = {23},
number = {3},
issn = {0740-7475},
year = {2006},
pages = {181},
doi = {http://doi.ieeecomputersociety.org/10.1109/MDT.2006.83},
publisher = {IEEE Computer Society},
address = {Los Alamitos, CA, USA},
}
 
 
RefWorks Procite/RefMan/Endnote
x 
 
TY - MGZN
JO - IEEE Design and Test of Computers
TI - The Need for a SiP Design and Test Infrastructure
IS - 3
SN - 0740-7475
SP
EP
EPD - 181
A1 - Kwang-Ting (Tim) Cheng,
PY - 2006
KW - SiP
KW - system in package
VL - 23
JA - IEEE Design and Test of Computers
ER -
 
Kwang-Ting (Tim) Cheng, University of California, Santa Barbara
Although successful and profitable applications have proven themselves in several market segments, significant challenges in system-in-package design and test remain for broader adoption.
Index Terms:
SiP, system in package
Citation:
Kwang-Ting (Tim) Cheng, "The Need for a SiP Design and Test Infrastructure," IEEE Design and Test of Computers, vol. 23, no. 3, pp. 181, May/June 2006, doi:10.1109/MDT.2006.83
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