loading...
An E-Services Infrastructure for Power Distribution
DOI Bookmark: http://doi.ieeecomputersociety.org/10.1109/MIC.2005.50May/June 2005 (vol. 9 no. 3) pp. 52-59
 This Article 
 
Buy PURCHASE ARTICLE: $19
PDF
HTML
Buy IEEE Xplore Subscribers
 
 Share 
   
 Bibliographic References 
   
 Add to: 
 
Digg
Furl
Spurl
Blink
Simpy
Google
Del.icio.us
Y!MyWeb
 
 Search 
   
ASCII Text
x 
 
Philippe Lalanda, "An E-Services Infrastructure for Power Distribution," IEEE Internet Computing, vol. 9, no. 3, pp. 52-59, May/June, 2005.
 
 
BibTex
x
 
@article{ 10.1109/MIC.2005.50,
author = {Philippe Lalanda},
title = {An E-Services Infrastructure for Power Distribution},
journal ={IEEE Internet Computing},
volume = {9},
number = {3},
issn = {1089-7801},
year = {2005},
pages = {52-59},
doi = {http://doi.ieeecomputersociety.org/10.1109/MIC.2005.50},
publisher = {IEEE Computer Society},
address = {Los Alamitos, CA, USA},
}
 
 
RefWorks Procite/RefMan/Endnote
x 
 
TY - MGZN
JO - IEEE Internet Computing
TI - An E-Services Infrastructure for Power Distribution
IS - 3
SN - 1089-7801
SP52
EP59
EPD - 52-59
A1 - Philippe Lalanda,
PY - 2005
KW - E- services
KW - power distribution
KW - OSGi
KW - J2EE
KW - mediation
VL - 9
JA - IEEE Internet Computing
ER -
 
Philippe Lalanda, Grenoble University
Delivering Web services based on data collected from distributed networks of smart devices presents several business and data-integration challenges for providers. Enterprise users need a scalable, standards-based mechanism that lets them run services without becoming experts in the technical aspects of service delivery. The Inside software infrastructure attempts to provide such a solution. Inside uses the Java 2 Enterprise Edition, the Open Services Gateway Initiative, and a suite of mediation components to address issues of scalability, dynamism, and transparency.
Index Terms:
E- services, power distribution, OSGi, J2EE, mediation
Citation:
Philippe Lalanda, "An E-Services Infrastructure for Power Distribution," IEEE Internet Computing, vol. 9, no. 3, pp. 52-59, May/June 2005, doi:10.1109/MIC.2005.50
Usage of this product signifies your acceptance of the Terms of Use.