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Toward Ideal On-Chip Communication Using Express Virtual Channels
DOI Bookmark: http://doi.ieeecomputersociety.org/10.1109/MM.2008.18January/February 2008 (vol. 28 no. 1) pp. 80-90
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Amit Kumar, Li-Shiuan Peh, Partha Kundu, Niraj K. Jha, "Toward Ideal On-Chip Communication Using Express Virtual Channels," IEEE Micro, vol. 28, no. 1, pp. 80-90, January/February, 2008.
 
 
BibTex
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@article{ 10.1109/MM.2008.18,
author = {Amit Kumar and Li-Shiuan Peh and Partha Kundu and Niraj K. Jha},
title = {Toward Ideal On-Chip Communication Using Express Virtual Channels},
journal ={IEEE Micro},
volume = {28},
number = {1},
issn = {0272-1732},
year = {2008},
pages = {80-90},
doi = {http://doi.ieeecomputersociety.org/10.1109/MM.2008.18},
publisher = {IEEE Computer Society},
address = {Los Alamitos, CA, USA},
}
 
 
RefWorks Procite/RefMan/Endnote
x 
 
TY - MGZN
JO - IEEE Micro
TI - Toward Ideal On-Chip Communication Using Express Virtual Channels
IS - 1
SN - 0272-1732
SP80
EP90
EPD - 80-90
A1 - Amit Kumar,
A1 - Li-Shiuan Peh,
A1 - Partha Kundu,
A1 - Niraj K. Jha,
PY - 2008
KW - flow control
KW - packet switching
KW - router design
KW - on-chip interconnects
VL - 28
JA - IEEE Micro
ER -
 
Amit Kumar, Princeton University
Li-Shiuan Peh, Princeton University
Partha Kundu, Microprocessor Technology Labs, Intel
Niraj K. Jha, Princeton University
Current on-chip networks use a packet-switched design with a complex router at every hop, which imposes significant communication energy, delay, and throughput overhead. We propose reducing energy and delay, and increasing throughput, using express virtual channels. Packets traveling along these virtual express lanes, which connect distant nodes in the network, bypass intermediate routers, significantly reducing router overhead.

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Index Terms:
flow control, packet switching, router design, on-chip interconnects
Citation:
Amit Kumar, Li-Shiuan Peh, Partha Kundu, Niraj K. Jha, "Toward Ideal On-Chip Communication Using Express Virtual Channels," IEEE Micro, vol. 28, no. 1, pp. 80-90, Jan./Feb. 2008, doi:10.1109/MM.2008.18
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