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A Stress-Point Resolution System Based on Module Signatures
Greenbelt, Maryland December 03-December 04
DOI Bookmark: http://doi.ieeecomputersociety.org/10.1109/SEW.2003.127074328th Annual NASA Goddard Software Eng ...
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Dolores Zage, Ball State University, Muncie, IN
Wayne Zage, Ball State University, Muncie, IN
This paper introduces a framework to provide design and testing guidance through a stress-point resolution system based on a module signature for module categorization. A stress-point resolution system includes stress-point identification and the selection of appropriate mitigation activities for those identified stress-points. Progress has been made in identifying stress-point to target the most fault-prone modules in a system by the module signature classification technique. Applying the stress-point prediction method on a large Motorola production system with approximately 1500 modules and comparing the classified modules to change reports, misclassification errors occurred at a rate of less than 2%. After identifying the stress point candidates, localized remedial actions should be undertaken. This algorithmic classification may suggest more insights into defect analysis and correction activities to enhance the software development strategies of software designers and testers.
Citation:
Dolores Zage, Wayne Zage, "A Stress-Point Resolution System Based on Module Signatures," sew, pp.193, 28th Annual NASA Goddard Software Engineering Workshop (SEW'03), 2003
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